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Internal observation of IC chip and of silicone wafer is possible by using Hamamatsu's NIR camera which is high resolution, high sensitivity, and high S/N ratio. The micro observation type and wafer complete observation type which use an infrared microscope are prepared. Micro type IC internal inspection system can observe condition of metal wiring inside IC, wirebonding, and die bonding, and is the best for the analysis of a flip chip. Wafer complete observation type can observe the voids of bonded wafers, and cracks, internal defects of wafer.
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