Optical MicroGauge

The C8125-01 measures thickness by using the interference of light to detect the front and reverse sides of the wafer. With this feature, wafer thickness can be measured without being affected by protective film or patterns. Because this is a non contact type system, costly patterned wafers cannot be damaged and a highly accurate thickness measurement can be made. In addition, when thin processing of the wafer by various etching processes, it is also possible to carry out the inline monitoring of the wafer thickness. Therefore, ultrathin wafers can be fabricated with stability.

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Product Information

FEATURES
･  Non-contact  measurement  makes  no  damage  on  wafers 
･  Measures  patterned  wafers  and  wafers  with  protective  film
･  Measures  thickness  distribution  of  wafers  (C8870-01,  -02)
･  Wafer  thickness  during  wet  etching  can  be  monitored
･  In-line  measurement  from  one  side  is  possible

APPLICATIONS
･  Thickness  measurement  of  wafers  with  protective  film
･  Thickness  measurement  of  patterned  wafer
･  Thickness  distribution  measurement  of  wafers
･  Evaluation  of  the  etching  grinding  characteristics