|
FEATURES ・ High sensitivity thermal detector (InSb) used ・ Optimally designed IR optics ・ Analysis of thermal emissions image through the backside ・ 200 mm wafer chuck as standard
|
 |
APPLICATIONS ・ Short-circuit of metalization ・ Abnormality of contact holes ・ Microplasma leakage in oxide layer ・ Oxide layer breakdown ・ TFT leakage / Organic EL leakage location detection ・ Observation of temperature abnormalities in devices during the development of new semiconductor devices ・ Temperature mapping of semiconductor materials and PC board
|