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FEATURES ・ Simplified tester head docking for dynamic analysis ・ Multi-camera platform incorporating high precision stage optimized for backside observation. ・ Multiple detectors suitable for observing low voltage operating IC. ・ System design flexibility corresponding to the measurement of advanced ICs. ・ Variety of lens selection from 1x to 100x (Optional 10 lens-hole turret available.) ・ Backside observation prober available for measurements from an entire 300 mm wafer to a single die.
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OPTIONS ・ NanoLens for high-resolution and high-sensitivity observation ・ OBIRCH analysis function ・ Use of digital lock-in kit enhances the OBIRCH analysis detection functions ・ Dynamic analysis function by laser radiation ・ Failure analysis support system
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