The Solid State Division of Hamamatsu Photonics provides many types of opto-semiconductors used in wide applications ranging from medical and scientific fields to communications, industry and general electronics.
Si photodiodes manufactured based on our advanced semiconductor process technologies cover a broad spectral range from the near infrared to ultraviolet and even to high-energy regions.
The MPPC is a new type of photon counting device made up of multiple APD (avalanche photodiode) pixels operated in Geiger mode and available in room temperature operation.
Hamamatsu Photonics has developed and manufactured image sensors with high sensitivity and a wide dynamic range that are ideal for measurement applications in physics, chemistry and industry.
The photo IC is an intelligent optical sensor with diverse functions and integrating a photodiode with signal processing IC in the same package. Phototransistors are also provided.
Detectors with sensitivity to wavelengths above 1 um. Careful selection of material combinations allows offering a variety of types that cover a broad spectral range.
Light emitting diodes (LEDs) are opto-semiconductors that convert electric energy into light energy. Compared to laser diodes (LDs), LEDs offer advantages such as lower cost and longer service life.
X-ray flat panel sensor using the world's largest CMOS image sensor combined with a FOS. Delivers higher S/N, higher speed and wider dynamic range compared to flat panel sensors using amorphous materials.
HAMAMATSU mini-spectrometers are polychromators integrated with optical elements , an image sensor and a circuit.Light to be measured is guided into the entrance port of through an optical fiber and the spectrum measured with the built-in image sensor is output from the USB port to a PC for data acquisition.
By merging technologies in the opto-semiconductor, optics, assembly, testing and measurement, Hamamatsu Photonics can now offer a full line-up of transmitter/receiver devices for optical communications.
We are using our own in-house process and packaging technology to develop automotive devices that are highly reliable even over a wide operating/storage temperature range.