Go to Language SelectorGo to Global NavigationGo to Site SearchGo to Sub NavigationGo to ContentGo to Site Information

Hamamatsu Photonics
Home  |  Site Map  |  Inquiry  |  MyAccount
Language Selector Japanese English
Global Site

Global Navigation
Products Support Exhibition Research And Development Corporate Profile Investors
Search Search for: Search Help

Sub Navigation
Activities
Organization
Technology
Publication
Partner

Industry

Content

Leading towards making our vision in the field of industry a reality


Here, we introduce the seeds of technology that we possess in order to lead towards realizing our vision in the field of industry. Because industry and society will be undergoing significant changes as we move towards the future, our aim in this field is to make a contribution through opto-technology.

Wafer cutting using stealth dicing

Wafer cutting using stealth dicing

Stealth dicing technology


Stealth Dicing (SD) is a next-generation dicing technology in which the inside of a silicon wafer is irradiated with a laser at any desired depth to create a modification layer (SD layer), and then stress is applied externally through a means such as tape expansion to produce cracks in the Si wafer surface and minimize the dicing loss.

An example of machining using stealth dicing

An example of machining using stealth dicing

PATENTS


We have the following many Patents/ Patent Applications in this Technology: (1. Feb. 2007)

USP 6,992,026, Japanese Patent Nos. 3408805, 3626442, 3761565, 3761567, 3761566, 3624909, 3670267, 3790254, 3822626, 3762409, 3867003, 3867107, 3867109, 3867110, 3867101, 3867102, 3867103, 3867100, 3867104, 3867105 and 3869850. Taiwan Patent No. I2500060, Korean Patent No. KR10-0667460 and 32 US Patent Applications, 143 Japanese Patent Applications, 35 Taiwan Patent Applications, 28 European Patent Applications, 27 Korean Patent Applications, 30 China Patent Applications, and many patent applications in Thai, Malaysia, India, Philippine, Singapore, Israel etc.

Stealth Dicing Website -SD_Web-

Stealth Dicing Website -SD_Web-
This website is officially authorized by Hamamatsu Photonics to introduce the guest to the latest available technical and laser processing information on stealth dicing.

Technical Information Document Download



On our global Web site, under the heading "What Can We Do With Light?" (under "Special Contents"), we explain our thoughts concerning how we want to go about creating new fields of industry based on opto-technology. We hope you'll take a look at that along with the information provided here.




Hamamatsu Photonics K.K
Site Information Terms of Use Privacy Policy Help
Copyright © Hamamatsu Photonics K.K. All Rights Reserved.